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Sputtering Physical Vapour Deposition (PVD) Coatings: A Critical Review on Process Improvement and Market Trend Demands

dc.contributor.authorBaptista, Andresa
dc.contributor.authorSilva, F.J.G.
dc.contributor.authorPorteiro, Jacobo
dc.contributor.authorMíguez, José
dc.contributor.authorPinto, Gustavo Filipe
dc.date.accessioned2020-04-27T16:42:19Z
dc.date.available2020-04-27T16:42:19Z
dc.date.issued2018
dc.description.abstractPhysical vapour deposition (PVD) is a well-known technology that is widely used for the deposition of thin films regarding many demands, namely tribological behaviour improvement, optical enhancement, visual/esthetic upgrading, and many other fields, with a wide range of applications already being perfectly established. Machining tools are, probably, one of the most common applications of this deposition technique, sometimes used together with chemical vapour deposition (CVD) in order to increase their lifespan, decreasing friction, and improving thermal properties. However, the CVD process is carried out at higher temperatures, inducing higher stresses in the coatings and substrate, being used essentially only when the required coating needs to be deposited using this process. In order to improve this technique, several studies have been carried out optimizing the PVD technique by increasing plasma ionization, decreasing dark areas (zones where there is no deposition into the reactor), improving targets use, enhancing atomic bombardment efficiency, or even increasing the deposition rate and optimizing the selection of gases. These studies reveal a huge potential in changing parameters to improve thin film quality, increasing as well the adhesion to the substrate. However, the process of improving energy efficiency regarding the industrial context has not been studied as deeply as required. This study aims to proceed to a review regarding the improvements already studied in order to optimize the sputtering PVD process, trying to relate these improvements with the industrial requirements as a function of product development and market demand.pt_PT
dc.description.versioninfo:eu-repo/semantics/publishedVersionpt_PT
dc.identifier.doi10.3390/coatings8110402pt_PT
dc.identifier.urihttp://hdl.handle.net/10400.22/15871
dc.language.isoengpt_PT
dc.peerreviewedyespt_PT
dc.publisherMDPI
dc.relation.publisherversionhttps://www.mdpi.com/2079-6412/8/11/402pt_PT
dc.subjectPVD optimization processpt_PT
dc.subjectPVD techniquept_PT
dc.subjectSputteringpt_PT
dc.subjectMagnetron sputteringpt_PT
dc.subjectDeposition improvementpt_PT
dc.subjectReactorspt_PT
dc.titleSputtering Physical Vapour Deposition (PVD) Coatings: A Critical Review on Process Improvement and Market Trend Demandspt_PT
dc.typejournal article
dspace.entity.typePublication
oaire.citation.issue11pt_PT
oaire.citation.startPage402pt_PT
oaire.citation.titleCoatingspt_PT
oaire.citation.volume8pt_PT
person.familyNameBaptista
person.familyNameSilva
person.familyNamePinto
person.givenNameAndresa
person.givenNameFrancisco
person.givenNameGustavo Filipe
person.identifier1422904
person.identifier.ciencia-id6218-CAE6-A673
person.identifier.ciencia-idB81C-4758-2D59
person.identifier.ciencia-idA01E-E566-B4D8
person.identifier.orcid0000-0001-6968-3450
person.identifier.orcid0000-0001-8570-4362
person.identifier.orcid0000-0003-0032-7356
person.identifier.ridI-5708-2015
person.identifier.scopus-author-id56870827300
person.identifier.scopus-author-id57192392216
rcaap.rightsopenAccesspt_PT
rcaap.typearticlept_PT
relation.isAuthorOfPublication97f67b94-982c-43fe-a0a2-a7d3243ee9cd
relation.isAuthorOfPublicationd050c135-4d9d-4fb2-97d1-cac97be3f6b9
relation.isAuthorOfPublicationd4ec0a75-5b85-4ce2-a656-694c806fb9d9
relation.isAuthorOfPublication.latestForDiscoveryd4ec0a75-5b85-4ce2-a656-694c806fb9d9

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