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Advisor(s)
Abstract(s)
In the last few years, an increasing use of
Programmable Logic Devices (PLDs) in the development
of new embedded and systems-on-a-chip (SoC) solutions
created the need of new test procedures for this kind of
components.
Several approaches, depending on the type of PLDs
used, were proposed in the literature, addressing the test
of the configurable logic array, the interconnection arrays
and the configuration memory. However, very little work
has been done concerning the specific test of Input/Output
Blocks (IOBs) and pad-to-pin bonds.
In this paper, a method aimed at covering the test of
the IOBs structure in reprogrammable PLDs is proposed.
The interconnections between IOBs and other components
or connectors at board level are also targeted, benefiting
from the availability of Boundary Scan Test (BST) cells on
the IOBs of the major PLD families and from the use of
“active connectors”.
Description
Keywords
Programmable Logic Devices (PLDs) Boundary Scan Test Input/Output Blocks (IOBs)