Percorrer por autor "Porteiro, Jacobo"
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- Numerical Simulation Applied to PVD Reactors: An OverviewPublication . Pinto, Gustavo Filipe; Silva, Francisco; Porteiro, Jacobo; Mínguez, José; Baptista, AndresaThe technological evolution in the last century also required an evolution of materials and coatings. Therefore, it was necessary to make mechanical components subject to heavy wear more reliable, improving their mechanical strength and durability. Surfaces can contribute decisively to extending the lifespan of mechanical components. Chemical vapor deposition (CVD) and physical vapor deposition (PVD) technologies have emerged to meet the new requirements that have enabled a remarkable improvement in the morphology, composition and structure of films as well as an improved adhesion to the substrate allowing a greater number of diversified applications. Thin films deposition using PVD coatings has been contributing to tribological improvement, protecting their surfaces from wear and corrosion, as well as enhancing their appearance. This process can be an advantage over other processes due to their excellent properties and environmental friendly behavior, which gives rise to a large number of studies in mathematical modelling and numerical simulation, like finite element method (FEM) and computational fluid dynamics (CFD). This review intends to contribute to a better PVD process knowledge, in the fluids and heat area, using CFD simulation methods focusing on the process energy efficiency improvement regarding the industrial context with the sputtering technique.
- Sputtering Physical Vapour Deposition (PVD) Coatings: A Critical Review on Process Improvement and Market Trend DemandsPublication . Baptista, Andresa; Silva, F.J.G.; Porteiro, Jacobo; Míguez, José; Pinto, Gustavo FilipePhysical vapour deposition (PVD) is a well-known technology that is widely used for the deposition of thin films regarding many demands, namely tribological behaviour improvement, optical enhancement, visual/esthetic upgrading, and many other fields, with a wide range of applications already being perfectly established. Machining tools are, probably, one of the most common applications of this deposition technique, sometimes used together with chemical vapour deposition (CVD) in order to increase their lifespan, decreasing friction, and improving thermal properties. However, the CVD process is carried out at higher temperatures, inducing higher stresses in the coatings and substrate, being used essentially only when the required coating needs to be deposited using this process. In order to improve this technique, several studies have been carried out optimizing the PVD technique by increasing plasma ionization, decreasing dark areas (zones where there is no deposition into the reactor), improving targets use, enhancing atomic bombardment efficiency, or even increasing the deposition rate and optimizing the selection of gases. These studies reveal a huge potential in changing parameters to improve thin film quality, increasing as well the adhesion to the substrate. However, the process of improving energy efficiency regarding the industrial context has not been studied as deeply as required. This study aims to proceed to a review regarding the improvements already studied in order to optimize the sputtering PVD process, trying to relate these improvements with the industrial requirements as a function of product development and market demand.