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Abstract(s)
Na situação atual da economia, a competitividade e a necessidade de sobrevivência das empresas obrigam a uma busca contínua por oportunidades de redução dos custos, através da melhoria contínua da eficácia e eficiência das operações. Tal poderá traduzirse através da capacidade das empresas em “Fazerem mais com o mesmo” ou “Fazerem o mesmo com menos”. O presente trabalho foi realizado na ATEP - Amkor Technology Portugal, S.A., empresa especializada no fabrico de semicondutores, localizada em Mindelo - Vila do Conde. O Principal objetivo deste trabalho consistiu em reduzir o número de defeitos por Contaminations (Contaminações) e Tape Residues (Resíduos de Cola) num produto específico (A) detetados num equipamento de inspeção automática de uma área de processo designada por AOIRECON (Automated Optical Inspection Reconstruction). A metodologia aplicada neste trabalho foi o DMAIC (Define, Measure, Analyze, Improve, Control). Em cada fase do ciclo utilizaram-se várias técnicas e ferramentas para caraterizar o problema, medi-lo, analisar as suas causas potenciais, aplicar ações de melhoria e, por fim, proceder ao respetivo controlo. Para tal, recorreu-se à métrica do DMAIC para reduzir os defeitos iniciais de 5219 PPM com base nos defeitos por milhão (PPM), sendo o objetivo final de 1500 PPM. Para finalizar serão apresentadas algumas sugestões de melhoria, bem como os métodos mais adequados para garantir o controlo do processo ao longo de tempo.
In the current state of the economy, the competitiveness and the need for survival of companies, require a continuous search for opportunities to reduce costs through the continuous improvement of the effectiveness and efficiency of operations. This can translate into the ability of companies to “Do more with the same” or “Do the same with less”. This work was carried out at ATEP - Amkor Technology Portugal, S.A., a company specialized in semiconductor manufacturing, located in Mindelo - Vila do Conde. The main objective of this work is to reduce the number of Contaminations and Tape Residues defects in a specific product (A) detected in an automatic inspection equipment of a process area designated by AOIRECON. The methodology applied in this work was DMAIC (Define, Measure, Analyze, Improve, Control). At each stage of the cycle, various techniques and tools have been used to characterize the problem, measure it, analyze its potential causes, implement improvement actions and then control it. To this end, Six Sigma metrics were used to quantify the problem (initial defects of 5219 PPM based on defects per million (PPM)), with the goal of Six Sigma reaching the 1500 PPM target. Several experiments were also carried out throughout this work with the aim of ensuring zero defects in product quality as well as process control and stabilization. Finally, some suggestions for improvement will be presented as well as the most appropriate methods to ensure process control over time.
In the current state of the economy, the competitiveness and the need for survival of companies, require a continuous search for opportunities to reduce costs through the continuous improvement of the effectiveness and efficiency of operations. This can translate into the ability of companies to “Do more with the same” or “Do the same with less”. This work was carried out at ATEP - Amkor Technology Portugal, S.A., a company specialized in semiconductor manufacturing, located in Mindelo - Vila do Conde. The main objective of this work is to reduce the number of Contaminations and Tape Residues defects in a specific product (A) detected in an automatic inspection equipment of a process area designated by AOIRECON. The methodology applied in this work was DMAIC (Define, Measure, Analyze, Improve, Control). At each stage of the cycle, various techniques and tools have been used to characterize the problem, measure it, analyze its potential causes, implement improvement actions and then control it. To this end, Six Sigma metrics were used to quantify the problem (initial defects of 5219 PPM based on defects per million (PPM)), with the goal of Six Sigma reaching the 1500 PPM target. Several experiments were also carried out throughout this work with the aim of ensuring zero defects in product quality as well as process control and stabilization. Finally, some suggestions for improvement will be presented as well as the most appropriate methods to ensure process control over time.
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Keywords
Semicondutores Wafers Seis Sigma DMAIC Resíduos de cola Contaminações Taguchi Semiconductors Six Sigma Tape Residues Contaminations