Browsing by Author "Carbas, Ricardo J.C."
Now showing 1 - 3 of 3
Results Per Page
Sort Options
- Mechanical and thermal characterization of a structural polyurethane adhesive modified with thermally expandable particlesPublication . Banea, Mariana D.; Silva, Lucas F. M. da; Carbas, Ricardo J.C.; Campilho, RaulThermally expandable particles (TEPs) are used in a wide variety of applications by industry mainly for weight reduction and appearance improvement for thermoplastics, inks, and coatings. In adhesive bonding, TEPs have been used for recycling purposes. However, TEPs might be used to modify structural adhesives for other new purposes, such as: to increase the joint strength by creating an adhesive functionally modified along the overlap of the joint by gradual heating and/or to heal the adhesive in case of damage. In this study, the behaviour of a structural polyurethane adhesive modified with TEPs was investigated as a preliminary study for further investigations on the potential of TEPs in adhesive joints. Tensile bulk tests were performed to get the tensile properties of the unmodified and TEPs-modified adhesive, while Double Cantilever Beam (DCB) test was performed in order to evaluate the resistance to mode I crack propagation of unmodified and TEPs-modified adhesive. In addition, in order to investigate the behaviour of the particles while encapsulated in adhesives, a thermal analysis was done. Scanning electron microscopy (SEM) was used to examine the fracture surface morphology of the specimens. The fracture toughness of the TEPs-modified adhesive was found to increase by addition of TEPs, while the adhesive tensile strength at yield decreased. The temperature where the particles show the maximum expansion varied with TEPs concentration, decreasing with increasing the TEPs content.
- Smart Adhesive Joints: An overview of recent developmentsPublication . Banea, Mariana D.; Silva, Lucas F. M. da; Carbas, Ricardo J.C.; Campilho, RaulAdhesive bonding is a viable technique for joining a wide range of materials. However, increasing the lifetime, reducing the costs, and improving the safety of structures are highly demanded nowadays. Hence, the development of new technologies and processes for easy recycle, heal, or self-heal of bonded structures are becoming of great interest for the industry. This paper provides an overview of the current developments in the use of “smart” adhesive technology and introduces the reader to early findings on the use of self-healing materials, thermally expandable particles, and nanoparticles, among others, in adhesives and their potential to increase the reliability of adhesive joints.
- Structural adhesives modified with thermally expandable particlesPublication . Banea, Mariana D.; Silva, Lucas da; Carbas, Ricardo J.C.; Campilho, RaulIn this study, the behaviour of two structural adhesives modified with thermally expandable particles (TEPs) was investigated as a preliminary study for further investigations on the potential of TEPs in adhesive joints. Tensile bulk tests were performed to get the tensile properties of the adhesives and TEPs-modified adhesives. In order to determine the expansion temperature of the particles while encapsulated in these particular adhesive systems, the variation of the volume of adhesive samples modified with different TEPs concentration as a function of temperature was measured. Further, the possibility of any chemical interactions between TEPs and adhesives matrix in the TEPs-modified specimens was verified by a Fourier transform infrared spectroscopy analysis. Finally, the fracture surfaces of the unmodified and TEPs-modified specimens, as well as the dispersion and the morphology of the particles, were examined by a scanning electron microscopy analysis. It was found that the stiffness of the TEPs-modified adhesives is not affected by incorporation of TEPs in the adhesives matrix, while the tensile yield strength decreased by increasing the wt% TEPs content. In applications of such particular materials (TEPs-modified adhesives), the temperature should be controlled to stay between 90°C and 120°C in order to obtain the highest expansion ratio. At a lower temperature, not all the particles will expand, and above, the TEPs will deteriorate and as a result the TEPs-modified adhesives will deteriorate.