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Cu(In,Ga)Se2 based ultrathin solar cells the pathway from lab rigid to large scale flexible technology

2023Artigo científico Acesso aberto
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dc.contributor.authorLopes, T. S.
dc.contributor.authorTeixeira, J. P.
dc.contributor.authorCurado, M. A.
dc.contributor.authorFerreira, B. R.
dc.contributor.authorOliveira, A. J. N.
dc.contributor.authorCunha, J. M. V.
dc.contributor.authorMonteiro, M.
dc.contributor.authorViolas, A.
dc.contributor.authorBarbosa, J. R. S.
dc.contributor.authorSousa, P. C.
dc.contributor.authorÇaha, I.
dc.contributor.authorBorme, J.
dc.contributor.authorOliveira, K.
dc.contributor.authorRing, J.
dc.contributor.authorChen, W. C.
dc.contributor.authorZhou, Y.
dc.contributor.authorTakei, K.
dc.contributor.authorNiemi, E.
dc.contributor.authorDeepak, F. L.
dc.contributor.authorEdoff, M.
dc.contributor.authorBrammertz, G.
dc.contributor.authorFernandes, P. A.
dc.contributor.authorVermang, B.
dc.contributor.authorSalomé, P. M. P.
dc.date.accessioned2024-03-26T13:14:07Z
dc.date.available2024-03-26T13:14:07Z
dc.date.issued2023
dc.description.abstractThe incorporation of interface passivation structures in ultrathin Cu(In,Ga)Se2 based solar cells is shown. The fabrication used an industry scalable lithography technique—nanoimprint lithography (NIL)—for a 15 × 15 cm2 dielectric layer patterning. Devices with a NIL nanopatterned dielectric layer are benchmarked against electron-beam lithography (EBL) patterning, using rigid substrates. The NIL patterned device shows similar performance to the EBL patterned device.The impact of the lithographic processes in the rigid solar cells’ performance were evaluated via X-ray Photoelectron Spectroscopy and through a Solar Cell Capacitance Simulator. The device on stainless-steel showed a slightly lower performance than the rigid approach, due to additional challenges of processing steel substrates, even though scanning transmission electron microscopy did not show clear evidence of impurity diffusion. Notwithstanding, time-resolved photoluminescence results strongly suggested elemental diffusion from the flexible substrate. Nevertheless, bending tests on the stainless-steel device demonstrated the mechanical stability of the CIGS-based device.pt_PT
dc.description.versioninfo:eu-repo/semantics/publishedVersionpt_PT
dc.identifier.citationLopes, T.S., Teixeira, J.P., Curado, M.A. et al. Cu(In,Ga)Se2 based ultrathin solar cells the pathway from lab rigid to large scale flexible technology. npj Flex Electron 7, 4 (2023). https://doi.org/10.1038/s41528-023-00237-4pt_PT
dc.identifier.doi10.1038/s41528-023-00237-4pt_PT
dc.identifier.issn2397-4621
dc.identifier.urihttp://hdl.handle.net/10400.22/25219
dc.language.isoengpt_PT
dc.peerreviewedyespt_PT
dc.publisherNaturept_PT
dc.relation.publisherversionhttps://www.nature.com/articles/s41528-023-00237-4pt_PT
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/pt_PT
dc.subjectUltrathin Cu(In,Ga)Se2pt_PT
dc.subjectNanoimprint lithographypt_PT
dc.subjectFlexible substratept_PT
dc.subjectStainless-steelpt_PT
dc.subjectInterface passivation structurespt_PT
dc.titleCu(In,Ga)Se2 based ultrathin solar cells the pathway from lab rigid to large scale flexible technologypt_PT
dc.typejournal article
dspace.entity.typePublication
oaire.citation.issue1pt_PT
oaire.citation.titlenpj Flexible Electronicspt_PT
oaire.citation.volume7pt_PT
person.familyNameFernandes
person.givenNamePaulo
person.identifier.orcid0000-0002-1860-7797
person.identifier.ridJ-5264-2013
person.identifier.scopus-author-id35568397500
rcaap.rightsopenAccesspt_PT
rcaap.typearticlept_PT
relation.isAuthorOfPublication75281af2-3dd9-4a53-a2eb-07de6b8e8ba4
relation.isAuthorOfPublication.latestForDiscovery75281af2-3dd9-4a53-a2eb-07de6b8e8ba4

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